Used ESEC 3100 Plus #9246254 for sale

ESEC 3100 Plus is a versatile high performance bonder for semiconductor packaging. This popular equipment offers a wide range of capabilities and features, allowing customers to tailor their production to their desired needs. The operator is able to choose between thermal, air, or ultrasonic bonding technologies for a broad range of materials in small, medium, and large packages. It can be used to bond a wide range of materials, such as copper, tungsten, Nickel, Kovar, and gold wire, along with other metals and materials. The electric and thermoplastic soldering methods available offer stable melting temperatures and fast bonding speeds. The bonder has 18 x-y-z axes for effortless flexing and handling of fragile structures, as well as a 0-90° tilt angle setting. Its designed for precise positioning at high speeds, allowing the operator to focus on the fine details. Its visual system includes a large 10.4" high-resolution touchscreen and comprehensive LED lighting, offering high quality viewing of the product during bonding. The device is equipped with advanced control parameters, allowing operators to carry out on-the-fly modifications as needed. The precision mode ensures accurate placement on delicate components. The quick curing mode allows for faster air cooling on components, allowing for higher throughput. The device's automated bond monitoring can detect and diagnose abnormalities in the process, and an in-process display of images helps the operator to quickly determine if the bond is complete. In addition, the unit can be integrated with vision systems for advanced substrate alignment and accurate bonding placement. 3100 Plus has been designed to meet the tightest production tolerances, delivering excellent performance in challenging applications. Its fast, reliable, and precision capabilities, coupled with its intuitive user interface, makes it an ideal solution for a wide range of bonding applications.