Used ESEC 3100 Plus #9251747 for sale

ESEC 3100 Plus is a state-of-the-art high-precision automated ball-bonding equipment from Palomar Technologies designed for the most advanced wire-bonding applications. It is capable of achieving reliable and repeatable wire bonds with a wide range of electronic components. The Essec 3100 Plus can be configured to accommodate various coding technologies such as middle-to-end, end-to-end, and loop bonding network bonds. It is designed with a dual-axis design and is built with precision x-y stages to ensure accuracy and repeatability for the most demanding applications. The x-y stages have a 6µm of travel range and a 160µm of accuracy, and they feature high resolution encoders for accurate wire-bonding control and positioning. The Essec ESEC 3100 Plus also features automated vision alignment capabilities, allowing for quick and easy part placement and alignment. The system utilizes advanced machine vision that has been proven to achieve decreased setup times and improved product quality. The machine vision features a dual camera unit that offers a 0.1micron x 0.1micron resolution with an 8-bit grayscale image along with a crosshair overlay for better accuracy. 3100 Plus also features powerful embedded controllers, I/O, and powerful software environment to increase the scalability and reliability of the automated wire-bonding process. The embedded control machine offers a true high-level programming language and is designed to provide complete control and easy integration into a variety of host systems and applications. The I/O includes 26 high-speed opto-isolated input/output lines for quick and reliable wire-bonding control. ESEC 3100 Plus also features a Vision Electronic Pick-and-Place and integrated Vacuum Pickup Probing to further enhance the wire-bonding process, and reduce the time it takes to place wires from the pick-and-place head. The Vacuum Pickup Probing utilizes a removeable tooling plate with manual or automatic switching for easy wire pickup. 3100 Plus is designed to increase reliability and reduce cycle times for precise automated wire-bonding operations. Its controllers, I/O, machine vision, and automated pick-and-place features work together to ensure accurate and repeatable bonding for both large and small electronic components.