Used ESEC 3100 Plus #9389548 for sale

ESEC 3100 Plus is an advanced semi-automatic wafer bonding equipment that provides precise and reliable ultra-high vacuum wafer bonding. It holds up to 10 wafers simultaneously and automates the whole process of bonding. It achieves superior bonding results through an in-plane accuracy of 5 μm on 6, 8, and 12-inch wafers. It also provides hermetic sealing and temperature uniformity of +/- 2°C through a unique pre-alignment and a special bonding plate design. 3100 Plus offers a user-friendly interface that enables easy setup and operation. It provides an ergonomic platform that facilitates the loading of wafers and enhances the operator's safety. It also allows for real-time monitoring and manual override, allowing for immediate response to unexpected issues during the process. The bonding cycle starts with pre-alignment. The system applies vacuum force to achieve a precise and uniform contact between the wafers and then heat is applied to soften and spread the sealant. The auto-bond clamp applies pressure, ensuring that the sealant fills the gap properly and seals the bond. The unit then cools the wafer, hardening the sealant. ESEC 3100 Plus also features an advanced measuring machine, comprised of two alignment targets which measure the alignment and centering of the wafers. It also measures local pressure and provides accurate feedback to the operator in order to ensure the best seal possible. 3100 Plus wafer bonding tool is a reliable and precise bonding asset that delivers high-quality wafer bonding in all types of ultra-high vacuum applications. Thanks to its intuitive user-interface, its advanced pre-alignment feature, and its sophisticated pressure model, it ensures precision and reliability in the bonding process. By utilizing the very latest in wafer bonding technology, it allows users to achieve superior bonding results with greater efficiency.