Used ESEC 3100 #293663184 for sale

ESEC 3100 is a high-performance hot plate/heat assist thermal diffusion bonding tool. This bonder is widely used in a variety of industries, including medical, aerospace, microelectronics, and military applications. The bonder is designed to provide accurate and precise three-dimensional temperature control for a wide range of applications including die-to-substrate, chip-to-substrate, substrate-to-substrate, or chip-to-die bonding. 3100 bonder features a computer-controlled rapid thermal gradient profile that provides a fast setup that can be used for a variety of joining processes. This rapid thermal gradient profile is created using high-temperature heaters and precision temperature sensors that are strategically placed around the workpieces in order to accurately monitor and control each process parameter. The bonder also offers a high-temperature surface that can reach 1,000°C (1,832°F). In addition, the bonder features a vacuum chuck that is capable of securing the substrates in place for the joining process. ESEC 3100 has a variety of automation options, as well as a user friendly, graphical interface, which simplifies operation and provides feedback regarding process parameters. The bonder also features intuitive software and diagnostic features that enable easy upscaling and troubleshooting of the joining process. 3100 is equipped with safety features such as a photoelectric sensor that keeps operators away from the heating zone area as well a temperature sensor that monitors the bonding process. Thanks to its versatility and rapid bond cycle, ESEC 3100 bonder is able to deliver superior thermal and electrical performance, making it the perfect choice for a range of applications. This high-precision bonder is an invaluable tool for a wide variety of joining processes.