Used ESEC 3100 #293793633 for sale

ESEC 3100 is a dedicated electronic bonding equipment designed to provide high-performance, high-precision wire and ribbon bonding. This system features the company's patented and proven OptoLoop® technology, a pattern recognition unit for automated wire and ribbon inspection. To ensure superior bond quality, the machine offers ultra-fast process monitoring, enabling real-time adjustments to the bonding parameters. Its high-precision wire alignment allows for accurate and repeatable bond placement, while its visionguided, multi-axis controlled bonding head provides process capability to produce high-precision bonds that meet customer requirements. The tool is designed with a large number of automated components to streamline the bonding process. To ensure consistent, accurate and repeatable bonds, the asset incorporates: a patented high-precision wire aligner, allowing precision bonding with the minimum of operator interaction; a vision guided multi-axis controlled wire bonding head; and a patented servo-controlled mask alignment model. The large bonding area provided by the equipment enables larger wire and ribbon sizes to be handled for faster single pass bonding. 3100 provides complete process control, including process safety and accuracy validation, and monitoring of in-process metrics. It also features program tracking, which allows for tracking the progress of the bond and alerting the operator to any issues or alarms before final completion. It allows for fast process start-up and production optimization, and it can easily be integrated with the customers' manufacturing information system (MIS) or data collection unit. The machine features a real-time user-configurable process monitoring tool, which enables operators to make real-time adjustments to the process parameters as needed. It also provides detailed statistical process control (SPC) feedback, allowing operators to log and analyze process data over time to ensure optimal bond results. Finally, it includes an intuitive graphical user interface (GUI), allowing operators to easily configure, monitor, and control the asset. ESEC 3100 is an ideal solution for applications where the highest-precision wire and ribbon bonding is required. Its advanced process control and automated components make it an ideal choice for high-volume production environments, providing increased productivity and consistent bond quality.