Used ESEC 3100 #9144403 for sale

ESEC 3100 is a high-performance bonding machine designed for fabricating electronic components by introducing a layer of flux between the components to reduce their susceptibility to oxidation. The machine is capable of creating a secure bond in mere seconds, with quick and easy loading and unloading of parts to optimize production throughput. The machine is built on a heavy-duty C-frame design, providing rigs strength and stability for increased precision in adhesive application. Its self-contained power supply allows the machine to run on any type of voltage, making it ideal for worksites with varying power sources. Additionally, an adjustable pressure plate ensures accurate adhesive application levels and prevents parts shifting during flux application. 3100 is automated for maximum efficiency and user-friendly operation. A fast cycle-start minimizes lag time and allows for seamless integration into the production line. A choice of flux materials such as rosin, ultraviolet curable applications, acrylics, and silicones can be used to accommodate variety of substrates and applications. ESEC 3100 offers advanced technology for the highest quality bonds. Its integrated temperature control system allows precise tuning of hot air temperature and away for temperature uniformity across the board. Fully programmable parameters such as dwell time, time to power-up and the pressure plate height can be stored for repeatable settings and longer life on sealing parts. The highly-durable construction of the machine ensures long-term reliability and reduced downtime. Featuring an ergonomic design, control panel access, and intuitive programming interface, 3100 is designed for easy operation and maintenance. Its durable components and advanced components allow for speedy operation and ensure superior results every time.