Used ESEC 3100 #9145798 for sale

ESEC 3100 is a precision automated wire bonding machine used in the semiconductor manufacturing industry. It boasts a maximum bond length of 6 mm, a maximum bond pitch of 3 mm and is capable of handling 78 wire feeder positions. The core feature of 3100 is its proprietary and highly reliable bonding technique, Micro-Interconnection Technology (MIT). This involves setting the loop-bond wire position to the bonding heart frame before the bonding operation even begins. The machine then generates a 55 micron loop-bond, which is a process that sets the wires and tie points automatically. MIT allows for very precise control of the wire tension and uniform loop-bonds for every product, regardless of its complexity. ESEC 3100 also offers a number of automatic functions, including wafer-level programmable micropositioner correction. This allows for precise control of the loops to achieve design targets and reduces unnecessary waste. It also has an integrated segmented bonded wedge manager to control the maximum bond length and tension, to ensure that the wires are placed in the optimal positions. In terms of safety features, 3100 has advanced sensor technology, providing proactive early warning of stoppage and potential machine interrupts. The machine also includes a simple and intuitive touchscreen control panel, which can be used to manage and modify machine settings. ESEC 3100 is equipped with a range of accessories to ensure the adaptability of the machine. It is fully compatible with most commonly used automated feeders, has a programmable height workspace that can be adjusted to suit various wafer sizes, and has a high-speed placement and bonding indexer for up to 56 loop-bond axes. It also includes a number of sensors and actuators, such as for wire-level sensitivity control and laser emitters and sensors for wafer-level correction. Overall, 3100 is a reliable and sophisticated precision automated wire bonding machine used in the semiconductor manufacturing industry. It has a number of impressive features, including a Micro-Interconnection Technology that ensures uniform loop-bonds for every product, a range of accessories for adaptability, and advanced safety features. With its ability to achieve precision wire tension and up to 78 wire feeder positions, ESEC 3100 is ideal for complex wire bonding applications.