Used ESEC 3100 #9145799 for sale

ESEC 3100 is a high-performance die bonder designed for a range of processes, including flip chip, wirebond, and die attach placement. The equipment features a compact design with a small footprint and a wide range of capability. It is able to bond quite accurately and with highly repeatable results. With 300um die placement accuracy and 8 um run-to-run repeatability, the device offers precise bonding for a variety of applications and processes. 3100 incorporates several advanced features that enable its high accuracy, low consumption, and reliable performance. It is equipped with on-board heaters and two heated enclosures for improved process repeatability and temperature control. There is also an automatic x-y alignment feature and a suite of software for optimizing alignment accuracy and process control. The system utilizes a 3-axis stage which is driven by a servo-motor unit to deliver smooth and accurate motion. The stage can move the die along the x,y, and z axes with high accuracy and repeatability and a repeatability of 8um without drift or misalignment. The z-axis can be powered via digital current for increased accuracy and a repeatability of 1 um. ESEC 3100 features an integratedviewing tool to facilitate optical inspection and placement verification prior to bonding. The device is also equipped with automated calibration routines that help ensure precise X-Y alignment and a repeatable bond process. The machine utilizes the latest vision technology to analyze images and data with high accuracy. The tool features automated process control, process verification, and fault detection. This ensures accurate and repeatable processes and safeguards against process errors or any potential contamination. It also offers remote monitoring and control, which enables process data sharing and remote management from anywhere. 3100 is designed to handle high-volume production of complex products, and its cutting-edge features enable efficient and reliable bonding. It is ideally suited for any application that requires precision bonding with high repeatability. For these reasons, ESEC 3100 is an ideal choice for any manufacturing process that requires precise and repeatable die bond placement.