Used ESEC 3100 #9218630 for sale

ESEC 3100 bonder is an automated wirebonding equipment engineered to deliver optimized performance at an economically-friendly price. Featuring automation systems that reduce manual intervention, 3100 bonder is a reliable device that produces high-quality bonds. This system is ideal for many types of peripheral substrates, such as chip carriers, PC boards, and MCMs. ESEC 3100 can be used to create both ultrasonic and thermosonic bond connections. It is equipped with a Closed-Loop Baller Controller, which helps it achieve reliable and repeatable bond heights with minimal effort. The machine utilizes a linear X-Y motion unit and a manual Z-axis adjustment to ensure accurate placement of the bond head. Moreover, 3100 has the ability to store up to 50 recipe files, allowing easy program recall when needed. This machine is also highly versatile and can handle a range of wire diameters, loop styles, and bond loop configurations. ESEC 3100 also features a monitor to display the number of bonds, bond height, and the total number of bonds. These displays let operators easily adjust the parameters needed for various jobs. Perhaps the most distinctive feature of 3100 is its fully servo controlled wire tieback function. This allows for the creation of uniform bonds that optimize bonding process speed and accuracy. Moreover, the tool is equipped with a wire feeding asset that can feed both loose and ribbon wire. The ribbon spooler holds up to two full reels of wire, with the lower reel used to feed the upper reel. This dual-spooling capability ensures optimal productivity in wire bonding. Overall, ESEC 3100 bonder is an advanced, cost-effective tool that offers improved control, accuracy and process consistency. Equipped with advanced features that facilitate higher quality wire bonding, this model is well-suited for applications in the automotive, electronics, aerospace, and medical industries. It is an ideal solution for reliable, high speed wire bonding operations.