Used ESEC 3100 #9230424 for sale

ESEC 3100 is a fully automated wire bonder specifically designed for the manufacturing of electronic products. It is a combination of the latest machine platform technology and improved software algorithms. The machine has a compact and ergonomic design making it suitable for automated production without operator intervention. 3100 has an advanced design consisting of a die attach stage and a bond head. The die attach stage consists of a ball bonder and wedge bonder, which are facilitated with vision alignment, thermal filtration and shuttering. The bond head also contains an integrated vision system, adjustable tooling and automatic wire threading. This combination of features ensures accurate wire bonding over a wide range of applications. The machine also has an integrated Dielectric Breakdown Detector (DBD), which allows for the pinpointing of intermittent bond quality issues. This helps to reduce quality issues and decrease production costs. The machine has an automated wire cleaning system which helps to eliminate contamination and improve process repeatability. In terms of software, ESEC 3100 is loaded with a user-friendly interface which allows the user to control the machine, input data and view machine diagnostics. It is also embedded with a range of controls functions, such as an in-circuit self-test, material test, and a fast cure parameter optimization. These features allow users to customize their process and improve production yields. To ensure safety and reliability, 3100 has an enclosed micro-clean room, a special loader and unloader system, as well as a robot hand-off unit. This machine is perfect for mass production of precision industrial parts and products, such as LEDs and automotive components, because of its high accuracy and repeatability. Overall ESEC 3100 is an advanced, easy to use and cost effective bonder that is suitable for a variety of electronic applications. Its user-friendly interface makes it ideal for any level of wire bonder operator.