Used ESEC 3200 P5 #9121234 for sale

ESEC 3200 P5 is a high performance, low cost Bonding tool that is suitable for production applications. It is the latest in a long line of ESEC Bonders and has been designed to provide superior performance in the bonding of semiconductor and optoelectronic components. 3200 P5 offers a range of features designed to make bonding easier and more efficient, while providing a reliable and robust production environment. ESEC 3200 P5 has a combination of a universal shearing and scribing station, a pick and place gripper, and a die bonder. It is capable of supporting a variety of wafer sizes, component types and configurations, providing a wide range of options for different applications. Depending on the application, 3200 P5 offers auto or manual loading, and it can accommodate wafer diameters up to 6". Furthermore, ESEC 3200 P5 has precision optomechanical registration that allows for controlled dicing, and precise alignment during bonding. 3200 P5 is a very reliable and robust system, and it has been designed to withstand long production runs. Its controls and software are designed for easy operation, with auto, semi-auto and manual control settings. This offers great reliability and ensures that production processes are smooth and efficient. ESEC 3200 P5 also offers a variety of die bonding capabilities, including epoxy, silver-filled epoxy, eutectic, and bumped wafers. It can also be used for wedge bonding, thermocompression, and other methods. 3200 P5 is a fully automated platform with a multitude of features and settings. It can be equipped with a temperature chamber, allowing precise temperature control over a large range of temperatures. It also has a process monitor, RFID reader, sensor, and interface for traceability and process monitoring. ESEC 3200 P5 is a reliable and versatile bonding tool, capable of producing high quality bonds and providing an efficient production advantage. 3200 P5 provides users with a cost-effective solution for bonding components in industrial or consumer electronics applications. Its multi-functional capabilities, a wide variety of bonding capabilities, and its ability to productionize make it a great choice for any production environment.