Used ESEC 3200 P5 #9294190 for sale

ESEC 3200 P5 is an advanced precision bonder designed for a number of semiconductor assembly applications, such as flip chip solder ball attach, die attach, and wafer bumping. The bonder is equipped with a long arm design that allows flexibility in process development and experimentation. It provides a range of bond head types, including Bonding Wedge, Force Mode, Point-Wedge, Preheat, Tacky Adhesive, and WedgeCrimp, as well as the ability to cope with direct EB ink jet dispensing. The large working area of 3200 P5 bonder makes it suitable for complicated processes that involve handling larger components or substrates. It is also capable of achieving high accuracy and repeatability with its fine motion control, allowing for precise control of bond pressure, bond time, and cornering. These features have been designed to facilitate high process yields for a wide range of applications. ESEC 3200 P5 bonder is equipped with advanced vision and vision-assisted assembly capabilities. Its VisForward feature uses advance machine vision algorithms to reduce inspection time. The bonder's vision-assisted alignment system allows for fast and accurate placement of components, leading to improved throughput and yield. 3200 P5 is capable of multi-functional processes, such as wafer attach and flip chip solder ball attach, using different process modes and heads. It also provides support for multiple programmable process cards, allowing operators to set up a range of different parameters in a single process. Furthermore, the bonder is designed to achieve high throughputs with its feeder system, enabling automatic loading of components to the workstage. ESEC 3200 P5 bonder is compatible with a wide range of compatible environment sensors, from cold to remove moisture, to hot to increase solder reflow. It also includes an optional bar code reader for process tracking and traceability. The device's touch control interface allows for effortless programming, setup, and control. Finally, 3200 P5 bonder is one of the most advanced precision bonders on the market, providing users with advanced features and advanced process control capabilities. Its large working area, flexible head types, vision-assisted assembly capabilities, multi-function processes, and automatic loading capabilities make it a valuable asset for any semiconductor assembly process.