Used ESEC 936.0002 #9087024 for sale

ESEC 936.0002 is an advanced automatic bonder, designed for lead-to-lead, lead-to-J-lead, and STS assembly of chip components. Developed by ESEC, a global leader in semiconductor assembly and packaging solutions, this innovative bonding technology enables traditional and modern assembly processes. This tool provides an efficient way to produce high-quality and reliable packages with ultra-precise bonding. ESEC 936.0002 offers superior accuracy and accuracy control, thanks to its patented self-centering lead traces alignment system. This system works by monitoring the actual lead trace position and adjusting it accordingly depending on the settings. The system also continually scans for lead trace defects at the alignment stage, ensuring the highest quality and reliability of bonds for hybrid and conventional assemblies. This state-of-the-art bonder also delivers greater accuracy and speed compared to other manual and conveyor belt methods. It offers an array of features to ensure optimal performance: from automated feeder loading and dispense height control to automatic temperature and power setting and cooling zone management. Moreover, it is equipped with safety-related features such as power shutdown in case of emergency, as well as FOUP & FOSB (Front-Opening Standard Receptacle Box) protection. With its high-quality bonding process and its quick and easy operation, ESEC 936.0002 bonder is especially suitable for high-speed production of standard and custom lead-frame packages. Thanks to this advanced bonder, manufacturers can now produce high-performance packages in a more efficient and accurate way, reducing costs and increasing product quality. ESEC 936.0002 allows manufacturers to achieve and maintain the highest standard in their assembly production environment.