Used ESEC E3006 F/X #9192031 for sale

ESEC E3006 F/X bonder is a high-performance, fully automatic wire bonder that has been designed to meet the unique needs of a range of industries, from semiconductor and microelectronic manufacturing to automotive, aerospace, and more. ESEC E3006 bonder is a workhorse in the field of bonders, designed to reduce time, cost and labor. It offers some of the highest quality, highest reliability, and best precision in the industry. The E3006 bonder is equipped with a specialized pre-bonding station that enables it to quickly and seamlessly align and form thin wires for use in high-density, flip-chip and BGA packages. The flexible wire bonding loop avoids unneeded wire destruction, and a wide range of loop parameters allows for precise bonding for almost any application. The E3006 also offers advanced wire bond formation- its high-precision wire guide system delivers error-free forming in almost any package shape and size. The E3006 bonder is designed to be efficient and user-friendly. This is aided by its intuitive LCD touchscreen, which enables easy programming of various settings and parameters. The E3006 has many customizable features that allow for a variety of wire bonding requirements, and its strong construction ensures stability and longevity in any environment. Additionally, its removable ultrasound bond head and interchangeable tooling system make it easy to customize for any application. ESEC E3006 F/X bonder is the ideal solution for automation and precision-critical wire bonding needs. Its ability to quickly and accurately bond and form wires helps ensure the highest levels of quality and reliability in a wide range of industries. With its range of customizable features and easy-to-use operation, the E3006 is the perfect choice for any wire bonding job.