Used ESEC Tsunami 3100 Plus #9200852 for sale

ESEC Tsunami 3100 Plus is an advanced production bonder that offers precision and accuracy in automated process control. It is designed to meet the industry's highest standards in manufacturing and assembly of integrated circuits, LED and other electronic components. It offers superior performance in the form of an optimal combination of both bonding and non-bonding processes. Tsunami 3100 Plus is specifically designed to be used with various substrate materials including ceramic, plastic, glass and metal. The main features of ESEC Tsunami 3100 Plus are its fixed 25-axis motion table, four independent dual-axis bonding heads with a total of eight motors, a singulated substrate magazine, build-in IC reject handling station, and a control equipment with open architecture. It also includes an automated dispensing station, an anodized aluminum frame, an air pressure regulator, a radial positioner and a built-in mechanical-tilting frame. Tsunami 3100 Plus utilizes advanced motion control and process optimization software to ensure precise bond placement and uniformity. The bonder features a wide range of bonding capabilities including ball bonding, wedge bonding and flat bonding. The motion control table allows a range of automated processes including pick-and-place of components, component soldering and component welds. The bonder also features a built-in X-Y component positioning system. The control unit of ESEC Tsunami 3100 Plus allows for a seamless integration into various manufacturing and assembly environments. The machine also features multiple diagnostic features to ensure that bonding is properly conducted and components are accurately placed. As well, the bonder includes an advanced CCD camera tool to monitor integrated circuit bond placement. Tsunami 3100 Plus provides an optimal automated process control solution for the highest level of precision and accuracy in component assemblies. The bonder allows for components to be accurately placed, combined with fast and reliable bonding processes. The bonder also includes a wide range of adjustable parameters to ensure optimal Assembly line performance.