Used ESEC Tsunami 3100 Plus #9263935 for sale

ESEC Tsunami 3100 Plus delivers unique bonding capabilities with its advanced multi-zone bonding technology. The Tsunami 3100 is a fully automated, programmable bonding equipment that has the capability to bond various substrates including Trimethylsiloxysilicate (TMS) tapes, thermal transfer films, thin films, rigid substrates, rigidizers, and thermoplastics. The 3100 Plus has a wide range of features such as an integrated Bond Program Manager (BPM) that stores and downloads bond parameters, a Network Link Interface (NLI) to allow real-time, inter-site communication, an ultra-sensitive Bond Pressure Sensor (BPS) to ensure accuracy, and an uncomplicated Operator Interface Panel (OIP) for ease of use. In addition, the 3100 Plus supports multiple bond sizes, including 0.006" to 0.030" wide slots. This makes it an ideal choice for high volume production runs and for quick changeover processes. The Tsunami 3100 also offers an advanced performance mode, the Auto-Optimization Bond Mode (AOBM). This mode can automatically optimize bond parameters to increase yield in a single step process. An automatic reference adjustment feature ensures the highest bond pressures are always maintained for the most reliable bonding. The 3100 Plus also includes an optional Automatic Cleaning System (ACS) with a UHV cleaning nozzle. This extra feature assists in the maintenance of the vacuum environment and in the elimination of residual contamination. The ACS is an essential component in any high-reliability bonding process. Tsunami 3100 Plus is an all-in-one unit that can be configured to meet specific requirements. It is highly capable, exceptionally reliable, and cost-effective. This makes it an ideal choice for those looking for a robust and reliable bonding machine that provides superior bond strength and repeatability.