Used ESEC TSUNAMI W3100 Plus #9177974 for sale

ESEC TSUNAMI W3100 Plus is a reliable bonding machine specifically designed for the semiconductor industry. It is capable of simultaneously joining multiple dies with low thermal impact and an excellent bond quality. This product is made with the advanced wire-to-die bonding technologies and features a rugged and reliable design with superior performance. W3100 Plus features a uniform suspension system, a quick thermal cycle adjustment, a quick servo cycle adjustment, precise parameter settings, and an integrated tempering mechanism. The suspension system holds the device with high accuracy and guarantees the best performance. The thermal cycle adjustment ensures the proper temperature for the bond while the servo cycle adjustment is for the adjustment of the wire profile during the process. ESEC TSUNAMI W3100 Plus offers precise, repeatable, and reliable wire bonding, owing to its variable speed capability which gives it unparalleled bonding of high pitch and small wire pitches. The integrated tempering mechanism eliminates the activity of diffused silicon and deformation of the wire surface, thus reducing the chances of wire break in the crossing stages. W3100 Plus offers a wide bonding range, from 0.1mm to 1.2mm pitch wires, and can work with a wide variety of wire materials such as gold, copper, and aluminum. It also comes with an intuitive and easy to use user interface, with a touch screen monitor and a keypad/trackball. Having a touch screen allows for more accurate and faster operations, and the keypad and trackball permit convenient manual adjustment of parameters. In summary, ESEC TSUNAMI W3100 Plus is a reliable bonder designed specifically for the semiconductor industry. It features a uniform suspension system, a quick thermal cycle adjustment, a quick servo cycle adjustment, precise parameter settings, and an integrated tempering mechanism. Furthermore, the device offers a wide bonding range, intuitive user interface, and flexible materials, making it an ideal choice for joining multiple dies with low thermal impact and excellent bond quality.