Used ESEC TSUNAMI W3100 Plus #9265579 for sale

ESEC TSUNAMI W3100 Plus bonding equipment is a world-class multi-purpose product designed with the explicit goal of providing efficient and precise bonding solutions in a wide range of industries. Its effectiveness and efficiency have earned it trust and appreciation from customers across the globe. It is a fully automated electric controlled bonding machine that boasts top-of-the-line programmable flexibility, allowing you to tailor your bonding solution to achieve the optimal results. It is constructed with a bottle feeding and carrier system that is robust and suitable for a diverse range of substrates, including both thin and thick materials. The bonding process utilizes a combination of heat and pressure to ensure the best results while maintaining a consistent speed and accuracy that are unrivaled in the industry. W3100 Plus is equipped with an array of advanced features to enhance its performance. Its advanced vision camera unit assists in machine management and a 6-axis robot arm enables users to program specific bonding pathways to accommodate production requirements. With an intuitive human-machine interface, it is capable of co-ordinating with other process parameters to ensure an efficient and clean final product. The top-notch end-effector allows you to select the exact point where the optimal bonding is to take place. Its high-accuracy pressure solder tool enables reliable and precise high-quality bonding that is both long-lasting and durable. It also incorporates a Vision Recognition technology that allows for facial recognition, while other features such as temperature control, humidity control, and air leakage detection ensure that all the components of the bonding solution are operating optimally, and within the safety parameters. In conclusion, ESEC TSUNAMI W3100 Plus bonding asset is a revolutionary product that has revolutionized the process of bonding for a variety of industries. Its multiple features enable it to consistently and reliably deliver high-quality bonded products even in hostile environments. Its vision-based optimization tools and 6-axis robot arm ensure top-notch results with precise application of heat and pressure. The model is suitable for both thin and thick substrate materials, and its smart technology continues to offer improved performance with every successive version.