Used ESEC TSUNAMI W3100 Plus #9286437 for sale

ESEC TSUNAMI W3100 Plus is an automated bonder for the assembly of flip chips, providing high-precision accuracy and superior automated handling. This bonder is ideal for the production of today's miniaturised electronics devices, using multiple process steps to provide quick and accurate assembly and bonding. W3100 Plus is a highly efficient bonder that allows for quick and precise alignment of the component leads to the circuit board. It has an automated vision equipment built in, allowing the unit to accurately align the component for bonding. The unit's vision system is also capable of determining the highest and lowest points of the component, which is then used to adjust the bond force for the best possible bond. The bonder has a metal bonding head that uses solid-state vacuum technology to control the head's motions, ensuring precise motion control to ensure the highest quality bond. Pressure, temperature, and force parameters can be set for each bond to ensure the best possible bond. The unit's force feedback unit allows for precise control over the force applied to ensure the best possible bond. This automated bonder can be programmed to very precise tolerances, and can handle components up to fifteen millimeters square. The unit is also capable of bond placement with a repeatability of 3 microns, at a speed of up to 300 bonds/minute. ESEC TSUNAMI W3100 Plus is designed to be easy to use and integrate into existing production lines. The unit is furnished with an adjustable and reusable material tray and a control machine panel, allowing for easy setup and adjustment. The unit can also be programmed to perform a bonding recipe, with parameters such as cycle time, pressure, temperature, and head force stored in the bonder's memory for quick and easy bond setup. The unit also boasts an automatic recognition tool that identifies the components being bonded and automatically adjusts the head to the correct height and pressure for each component. W3100 Plus automated bonder is a reliable and accurate bonder that can be used to quickly and accurately assemble today's miniaturised electronics devices. The bonder's automated vision asset, metal bonding head, and repeatable bonding parameters allow for quick and accurate assembly and bonding. The unit's easy setup and programmable recipe make it an ideal choice for use in production lines.