Used ESEC TSUNAMI W3100 Plus #9360828 for sale

ESEC TSUNAMI W3100 Plus is a next-generation automated wire bonder designed to meet the most demanding industrial needs. The machine uses an advanced micro-soldering process, which is capable of producing ultra-precise connections with the most robust bonds. Measuring 83.1 inches long, 50.4 inches wide, and 61.3 inches tall, the TSUNAMI W3100 Plus is an efficient and compact solution for wire bonding applications. Adopting a multi-functional, U-shaped configuration, the machine can service many different types of components, ranging from semiconductors to home appliances. With a height adjustable head and under-arm bridge, the TSUNAMI ESEC TSUNAMI W3100 Plus can accommodate components of various shapes and sizes. The machine is equipped with a high-accuracy linear servo motor equipment, designed to ensure highly precise and repeatable motion. With a speed of up to 1 m/s and a positioning accuracy of ±10 μm, the TSUNAMI W3100 Plus can guarantee seamless wire bonding process with extreme precision. The machine can also be equipped with an optional pulse pressure detection system to further improve overall bonding performance. The unit is also designed to meet the needs of modern manufacturing environments. The TSUNAMI ESEC TSUNAMI W3100 Plus is equipped with intuitive programming software as well as a robust automation machine. This allows the machine to be easily integrated into a variety of production processes as well as to be conveniently handled or controlled remotely. Built with an ergonomic design, the machine is also user-friendly, allowing operators to effectively manage wire bonding process with minimal effort. Thanks to its efficient and reliable performance, W3100 Plus is the perfect solution for any manufacturing application requiring fast and accurate wire bonding. With its robust construction, user-friendly design, and superior motion control, the machine is capable of fulfilling the most demanding needs of the industry.