Used ESEC TSUNAMI W3100 Plus #9360834 for sale

ESEC TSUNAMI W3100 Plus is a bonder designed for manual, automated and integrated placement of die attach adhesive material onto a variety of PCBs, ICs and other small component packages. It features a universal design that allows for quick setup and rapid production, and is capable of performing die attach adhesion processes with a wide variety of materials. This provides a solution for applications which require robust die attach adhesion to ensure signal integrity over extended periods of time. W3100 Plus features an X-Y adjustable application head with a pressure adjuster for optimal die attach adhesion control, regardless of the application. A single-axis manual indexer system provides an accurate indexed motion to guide the application head along the desired bond path. A temperature monitoring feedback loop maintains the correct temperature of the hot melt adhesive material to ensure consistent and repeatable adhesion quality. ESEC TSUNAMI W3100 Plus bonder is able to dispense hot melt adhesives accurately, and can work with a variety of substrates, such as DBC, aluminum or stainless steel. It also offers the capability of controlling pressure and dispensing temperature for specific adhesion application, while its integrated temperature monitoring system allows for traceability of the temperature during the process to ensure optimum adhesion performance. W3100 Plus provides a compact, yet very reliable solution for die attach adhesion requirements. It is capable of achieving high accuracy and repeatability levels, even in the most challenging applications. Additionally, its design allows for easy integration with other automation equipment, providing a full-scale solution for production lines that need to perform die attach adhesion process. Overall, ESEC TSUNAMI W3100 Plus is an advanced bonder with a modular design that offers a reliable and consistent solution for die attach adhesion processes, particularly suitable for a wide range of applications. It provides excellent performance, accurate and repeatable processes, and a reliable and efficient system which offers high throughput speeds.