Used ESEC TSUNAMI W3100 Plus #9360835 for sale

ESEC TSUNAMI W3100 Plus is a fully automated wire bonder designed to increase your production output with high reliability and efficiency. It has been designed to secure the best performance and reliability in any environment. W3100 Plus can accurately bond a variety of chip sizes and packages. Its advantaged, DCB and wedge bonding technology can significantly reduce cycle time and eliminate soft error risks. The aluminum alloy used by ESEC TSUNAMI W3100 Plus gives it excellent thermal properties and durability. It can also house a large range of top dies from two microns up to four mils in size. The top die is servo driven and has a highly accurate wire feed and bond positioning capability. The machine's dedicated software provides a wide range of features such as an intuitive user interface, automated process qualification and capability analysis, order management, real-time process monitoring, and historical data storage. User settings can be easily modified for various types of devices, package structures and wire materials. The high-precision and long-term reliability of W3100 Plus comes from a tightly regulated 25 kHz current loop, which is accurate enough to consistently bond wires without making errors. The operator can easily adjust parameters related to stiffness without having to move the machine. The movement speed can be set to 500, 1000 and 1500 kHz, with the maximum speed being 1.5kHz. ESEC TSUNAMI W3100 Plus is controlled by a PLC with HMI interface for easy-to-understand instruction and parameter setting. The PLC has a diagnosis system for diagnosing any abnormality in the machine. It also has a digital display and a power supply with protection circuit. All electrical parts are selected for the most precise, reliable performance. W3100 Plus is designed to deliver consistent performance and reliable results. It is suitable for all wire bonding applications, including WLCSP and Flip-Chip applications, while eliminating soft error risks, providing a high throughput, and ensuring long-term reliability.