Used ESEC TSUNAMI W3100 Plus #9360840 for sale

ESEC TSUNAMI W3100 Plus is a thermocompression (or thermocompression bonding) machine that can be used to join interconnections in the production of electronics. It uses pressure and temperature to create an ultra-strong bond between components, such as circuit boards and other electronic modules and components. The heavy duty bonding system is capable of creating pressure of up to 1.5 tons, and can be used for a range of tasks including insertion of PCBs onto larger SMT boards, soldering of large pin components, and high temperature bonding. It also features an adjustable temperature up to 350 degrees Celsius. W3100 Plus comes with an intuitive touch screen control panel which is easy to use and allows for complete operational control over the unit. It is also equipped with automatic pressure control, allowing users to set parameters for temperature and pressure, ensuring uniform and reliable bonds, regardless of the complexity of the appplication. Additionally, the machine also features automated temperature profiling, helping to ensure perfect heating and cooling cycles, and a uniform temperature profile for exceptional bonds. The unit is also designed with safety in mind. It features a safety cover for the pressure chamber and an emergency stop button to ensure user safety. It is also equipped with several measures against pressure surges, such as pressure relief valve, pressure safety alarm, and pressure leaking detection. ESEC TSUNAMI W3100 Plus is designed to provide reliable and high quality thermocompression bonding for a wide range of applications. Its adjustable temperature up to 350 degrees Celsius, automated pressure and temperature control, and automated temperature profiling ensures excellent results, while its user-friendly operating system makes it easy to use. With its robust construction, increased safety measures, and exceptional performance, W3100 Plus is an ideal choice for those looking for a reliable and powerful thermocompression bonding system.