Used ESEC TSUNAMI W3100 #9286424 for sale

ESEC TSUNAMI W3100 is a PVD bonder for wafer-level packaging and fan-out panel level packaging. It is a dual-purpose, high-capacity, multi-system architecture bonder which combines precision execution, high speed bonding capability and a robust process control software platform. W3100 offers several features such as a 4" and 5" optical system, a proprietary image analyzer, high accuracy for low step-height pattern, and a new transformers for high-accuracy and precision alignment. It provides a high-throughput capability with up to 160 wafers per hour (depending on the process) and up to 8 fan-out panels per hour. The bonder is designed with a unique modular architecture which enables flexibility and high scalability for various process needs. It allows for the combination of multiple technologies including ball-bump bonding, thermo-compression bonding, laser direct-bonding and die-attach processes. The software architecture features a Layer Database which stores processes for ball-bump bonding, thermo-compression bonding, die-attach processes, laser direct-bonding and multiple image recognition parameters. It is also equipped with an Image Analyzer which provides accuracy and consistency of imaging on different substrates. ESEC TSUNAMI W3100 is also fitted with a powerful control software which provides a "one-stop" solution for process setting, operation, execution and optimization. The software enables users to monitor and analyze every process step and provides real-time feedback for higher loading and process consistency. Furthermore, it offers an easy and user-friendly human-machine interface which is designed for intuitive operation. The bonder is designed with safety in mind, offering a redundant safety system and an emergency stop switch to ensure safe operation and protect personnel, materials and equipment. The bonder also helps operators increase operating efficiency and reduce production costs with its high throughput and innovative features. With its configurable design, W3100 is an excellent option for wafer-level packaging and fan-out panel level packaging applications.