Used ESEC TSUNAMI W3100 #9286426 for sale

ESEC TSUNAMI W3100 is a ball and wedge bonding machine for the application of electrical connections in various industries. It is designed for semiconductor packaging production lines, underfill applications, and hybrid packages. The machine has a 10" touch screen, quick-set tooling, and a high-speed vision equipment. The precision of the machine allows for the most accurate connections possible, and the user-friendly interface allows for easy and efficient operation. The machine offers various bonding modes, such as wedge bonding, ball bonding, stud-ball bonding, and slab bonding. It has an integrated ultrasonic cleaning system for pre-process operations. The integrated tool-position sensing unit offers quick-change tooling and automatic tool recognition. The machine provides various wedge bond-height control and ball-bond-height control functions. The integrated vision machine provides edge-contour detection for precision ball and wedge bonding. The vision tool also has an image correction tool that can be used to adjust up to 16-position corrections. W3100 has a dual-axis chuck asset with an original three-stage air flow design which allows for high-precision, stable bond control. Each of the chucks is individually controlled, and can be loaded with two different spools for maximum production. The machine has a flexible needle testing feature which can be used to verify voltage levels of hard bonds. It also provides digital input and output control, and can be automated to save time and reduce human error. ESEC TSUNAMI W3100 offers temperature control for precise, uniform temperature levels. The advanced dielectric heater ensures faster heating and cooling times. The machine also has a built-in vacuum model that allows for efficient wire-bond pulling and delicate wire-bending operations. For further convenience, W3100 has high ergonomic flexibility and can be configured to various parameters for specific production requirements. ESEC TSUNAMI W3100 is a versatile and efficient diamond ball and wedge bonding machine. It offers precision and accuracy at a fast rate, allowing for high-quality production and cost savings. The machine complies with modern safety and environmental regulations, and can be used for various industrial applications.