Used ESEC TSUNAMI W3100 #9360794 for sale

ESEC TSUNAMI W3100 is a bonder that is designed for the electronic assembly industry. Specifically, it is a semi-automatic heat staking and soldering equipment. Heat stake bonding is a process that uses a combination of heat and pressure to join two plastic materials, together. Soldering is a process that uses a combination of heat and an alloy material to join two electrical components together. W3100 is designed to be an efficient and precise method for both of these assemblies. It features a compact design with a manually controlled x/y table for accurate placement of components. With its enclosed working area, the system is also designed to protect operators from potential hazards of working with hot components and reduce environmental contamination from fumes. ESEC TSUNAMI W3100 is equipped with a PLC-based controller that allows operators to program and store up to 1000 different bond parameters. This allows the unit to be quickly and easily set up to different applications, resulting in faster production and lower costs. It is also fitted with a pressure-controlling device, which ensures that the pressure used during the bonding process is within user-defined parameters and does not exceed preset limits. W3100 also offers a range of safety features to help ensure a safe work environment. It is equipped with multiple safety sensors that monitor for problems during operation, and an emergency stop switch that can quickly power off the machine if needed. Additionally, its sensitive thermal control machine automatically controls and adjusts the heat during each cycle. Overall, ESEC TSUNAMI W3100 offers a reliable and efficient bonding solution for many different electronics assemblers. Its PLC-based controller, safety features, and accurate pressure control makes it an ideal choice for a range of applications.