Used ESEC TSUNAMI W3100 #9360799 for sale

ESEC TSUNAMI W3100 is a bonder designed for precision wire, ribbon, coaxial, and component bonding. It is capable of producing high-quality results, even at high production speeds. The machine has a modular design, which allows for various configurations depending on application needs. It features a wafer stocker, which holds up to 66 wafers for quick setup under a bonding head. There is a control interface with a controller, jogwheel, monitor, and keyboard. There is also a programmable microscope with 5X or 10X zoom capability. The TSUNAMI W3100 has a patented 3-axis motor design. The 3-axis head provides accurate bonding of components and wires with low vibration levels. The bonder has an air-cushioned stage for smooth operation and precise positioning of the components being bonded. The high-precision temperature control system stabilizes the bonding process, ensuring consistent results. The bonder is powered by an air pressure chamber, enabling it to bond different types of materials such as gold, silver, and alloys to sizes less than 1 mil. It is capable of working with a wide range of components from 0.8 mm to 7.6 mm thick. It also offers an In-line Pressure Device, allowing for precise control over pressure during the bonding process. The TSUNAMI ESEC TSUNAMI W3100 has a built-in data acquisition system which can be monitored in real-time. Various parameters such as temperature, pressure, and force can be measured and recorded for quality assurance. The machine has a working area of 600 x 475 mm, enabling it to handle large components. It also has a built-in storage system for storing up to 10,000 programs. All programs can be saved for later use, making it easier to repeat bonding processes. It is compliant with CE, UL, NRTL, and CSA safety standards. The TSUNAMI W3100 is the perfect choice for high-speed bonding of all types of wires and components. With its advanced features and design, it can be relied upon to produce consistent and reliable bonds.