Used ESEC TSUNAMI W3100 #9360815 for sale

ESEC TSUNAMI W3100 is an automated wire bonding machine designed for fine pitch and flat die bonding applications. It is a versatile and reliable wire-bond platform capable of handling high-volume production and prototyping needs. The TSUNAMI W3100 provides precise control over the bond formation process, allowing operators to achieve results that surpass those of manual processes. The machine uses an on-board vision system to detect misalignments and correct them, preventing the need for manual adjustment. The TSUNAMI ESEC TSUNAMI W3100 features three bond heads which can be interchanged and used for various bonding techniques, such as ball bonding, wedge bonding, and staples. The machine's variable force control settings allow users to precisely control the bond force for each application. W3100's CCD video microscope allows for vital quality control, as the operator is able to review each bond. In addition, the machine is equipped with real-time X-Y profiling to ensure perfect die placement, and a servo controlled Z-axis for accurate die movement. ESEC TSUNAMI W3100 also offers an auto-synchronized bobbin for simple reel handling, and can be used for applications which require multiple pass bonding. Finally, the machine features an easy-to-use operation system, making it accessible to operators of any experience level. W3100 is a highly reliable and versatile wire-bonding machine for rapid and precise fine pitch and flat die bonding needs.