Used ESEC TSUNAMI W3100 #9360818 for sale

ESEC TSUNAMI W3100 is a fully automated die bonder and is designed to provide high throughput and increase manufacturing yields. This machine is ideal for low to medium volume production applications and offers high cost-efficiency. W3100 has a user-friendly, graphical interface, and a 7-inch touchscreen for simple and precise control of the bonding process. This machine also features a high resolution camera which allows the user to verify the placement of the component before and after being bonded. It can automatically evaluate the current board for 100 percent inspection, providing instant feedback to the operator. ESEC TSUNAMI W3100 utilizes a flexible X-Y die shearing system. This system can quickly and accurately position and shear components, even on stippled surfaces. W3100 can handle headers up to 0.65mm thick, including BGA, QFP and Chipscale packages. It also provides an adjustable force up to 4N for optimum placement accuracy. ESEC TSUNAMI W3100 also comes equipped with advanced dispensing technology. This includes two stations for dispensing glue, paste, and other materials. The "Soft Squeeze" feature allows the dispensing head to gently apply glue around the component without smears or spills. W3100 also has a low-volume die bonding capability with a vision system for locating parts under the die. This eliminates the need for manually handling IC chips, allowing the production of small batches with reduced labor costs. In short, ESEC TSUNAMI W3100 is a reliable bonder that helps to reduce production costs and increase yields. It is user-friendly and provides a flexible solution for both low and medium volume die bonding. Additionally, its advanced features enable precise control and accuracy of the bonding process for the highest quality results.