Used ESEC WB-3100 #9279497 for sale

ESEC WB-3100 is a high-precision bonder designed for micro-assembly, flip chip bonding and precision die join thermal bonding. WB-3100 is designed with an integrated vision equipment and advanced motion control for controlled accuracy and repeatability. This makes it suitable for complex flip-chip and die join applications, and it's capable of placing and joining components ranging from 01005 components to 65mm wafers. It has a 300mm x 300mm XY stage with 8-micron resolution. The stage can reach speeds up to 100mm/s and repeatability of +/- 3mils (0.0008"). The system also has a programmable z-axis for vertical alignment control with +/- 50 microns of movement. ESEC WB-3100 is capable of copper wire bonding up to 50µm diameter wire (32 AWG) or 10µm eutectic. It is also able to bond using AuSn and AuSi bonding systems, and can handle components as fine as 01015 packages. It has an automatic feeder unit which holds the components in place with a vision machine which automatically corrects misalignments. The tool has an ergonomic design, with integrated keyboards and three work surfaces for viewing and placement. It also has a built-in 5MP camera that can be used for viewing and archiving images for process control documentation. WB-3100 is equipped with an advanced thermal delivery station which can be configured for hot bar, eutectic, infrared, and laser depending on the application. It also has an integrated time-temperature curve database which allows operators to store the parameters of each specific job. ESEC WB-3100 is a fully integrated, high-precision bonding solution for micro-assembly applications. It is designed with advanced motion control for high accuracy and repeatability, and the integrated vision asset provides reliable alignment. The model is capable of accuracy and repeatability of 0.0008" and can bond components as small as 01015 packages. It has a high-speed feeder and advanced thermal delivery station, programmable z-axis and built-in 5MP camera, making it an infallible choice for precision bonding tasks.