Used EVG / EV GROUP 501 #166262 for sale
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ID: 166262
Wafer Size: 6"
DVD bonder, up to 6"
Upgraded AB-1
Hole in center for DVD's (not for wafers)
Specifications:
Bond chamber:
For max. vacuum 5 x 10 -2 mbar
Pump time <3min from 1000 to 5 x 10-2 mbar
Purge time <10sec from high vacuum to 1 bar
Electronic rack pneumatic plug in unit, PC-interface card and slot for vacuum controller
With PC software control (requires Windows® 95 or higher)
Data storage on hard or floppy disk
Automatic control of the contact force
Automatic recording of the bond process
Storage of the values as ASCII file (can be used in other Windows® applications)
Personal computer included
Handling tool for unloading of bond tools
Software:
Easy program commands for all parameters for anodic and pressure bonding. Four free programmable in- and output interfaces (24 V) for control of optional accessories (vacuum pump, automatic valves, etc.)
Recipe protection via password; recipes can be read and used without knowing the password
Pressure cover:
For pressure bonding for 6" substrates
Adjustable contact force up to 3500N (790 lbf)
Resolution: 3.5 N steps
For vacuum level as specified in basic unit
Pressure insert:
Dedicated pressure insert for 5" discs
Compliant layer set
Vacuum equipment:
Oil-free roughing pump with a pumping capacity of 5m3/h ultimate vacuum 5,0x10E-2mbar abs
Imprint tool, 5":
For stamps up to Ø 125 mm
Bond chuck with mechanical clamping
Separation flags
Nitrogen or compressed air (dried, cleaned): 6-8 bar
Flow rate: 130 Liter / min (275 ft3/h)
Cooling water:
Pressure: 3 - 5 bar (44 - 73 psi)
Flow rate: 1 - 2 Liter/min
Connection diameter (outer diam.): 8mm
Temperature: 18 °C
Power: 120V/208V, 3 phase + ground (4 wire system), +/-5%, 50/60 Hz, direct hookup
Requirements:
max. oxygen content: < 4mg/kg
max. chloride content: < 100mg/kg
no aggressive carbon dioxide and ammonia should not be detachable
use GLYCOL: 30 - 50 %
pH value: 7 – 9
Missing:
Dial gauge for bow pin height
Lip seal
Temperature measurement not working properly
Currently stored in a cleanroom
1999 vintage.
EVG / EV GROUP 501 is a fully automated die bonder designed for precision die-to-substrate bonding of active, passive, and discrete devices. The bonder is capable of applying both standard and pressurized air reflow profiles for a variety of die bonding applications and processes. It is capable of processing wafer sizes from 5-100mm, and is equipped with advanced process control capabilities, including a fuzzy logic controlled vacuum system and pressure sensors. This provides the precision and repeatability needed for high quality die bonding. The bonder comes with a wide variety of bonding tools and supplies. It includes a standard die bonder head, PbSn flux, flux applicator, air reflow nozzle, and a secondary bonding head. It also includes a choice of high precision pyrometers to monitor process temperatures, as well as a heated bed plate for high temperature thermal processes. In addition, the bonder is also capable of high accuracy die positioning, controlled both through manual and automatic positioning. The die bonder has a maximum accuracy of +/- 1µm and can be precisely programmed through a PC user interface. The bonder is also equipped with an automatic die placement system that can be customized to match the geometry of the dies to be bonded. The bonder has a proprietary Powermatrix die bonder software that allows for programmable bonding parameters, as well as applied force and displacement monitoring. It is also capable of real-time data logging and off-line process monitoring. This data can be automatically exported to analysis software for further analysis. The bonder is also designed to work in an integrated environment integrating with upstream and downstream processes. In addition to the die bonder head, it is designed to integrate with standard SMEMA, SEMI, and SPEC test platforms. It supports backward compatibility with industry standard scripting languages such as GDS, Vartool, and Tcl. Finally, the bonder is designed for efficient maintenance and long product life. It features a self-diagnostic program to identify any potential problems, as well as a service reminder program that can be customized to remind users when additional maintenance is required. The bonder is also shipped with a comprehensive service manual, which contains detailed instructions for maintenance and troubleshooting.
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