Used EVG / EV GROUP 501 #9233043 for sale

EVG / EV GROUP 501 is a semi-automated wedge bonder used mainly for application in the manufacture of semiconductor devices. The machine is capable of wire bonding for mass production at unparalleled production speeds. It has an exceptional looping capability and excellent bond quality with minimal force and power requirements, which makes it ideal for use in sensitive electronic device production. EVG 501 bonder is equipped with a 20 megahertz (MHz) bond head, an optical microscope, seam monitor, solder ball inspection, cleave test and an open loop bonder controller. The bond head is a precision engineered component that is designed for a fast, accurate and repeatable wire bonding process. It can bond wires from 0.3 mil (0.0076 mm) to 3.5 mil (0.089 mm) in diameter, with a wire loop size from 50 to 230 um. The optical microscope allows for a high-resolution view of the wire bonding, the seam monitor ensures that the surface of the substrate is not damaged, the solder ball inspection verifies the correct position of the solder ball and the cleave test verifies the initial break point of the wire joining process. The open loop bonder controller is a high-performance control system that allows for automated operation without the need for manual programming. With its easy-to-use interface, it enables quick and consistent production and high-quality results. Moreover, its open architecture makes it possible to transfer data to other systems such as computers. EV GROUP 501 is designed to be used in manufacturing settings such as semiconductor assembly and test, micro-electronics, and optical fiber fabrication. It is capable of achieving high productivity and repeatability, while its advanced control system ensures reliable and faultless operation. The machine is also easily serviced, with parts and spare parts available from EVG. In summary, 501 is an exceptionally reliable and high-performance bonder that is perfect for mass production of sensitive electronic devices.