Used EVG / EV GROUP 501 #9244738 for sale

EVG / EV GROUP 501 is a full-equipment, stand-alone bonder. This bonder is designed to give users a streamlined and secure bonding process while ensuring a higher quality product and lower cost-of-ownership. The bonder utilizes a patent-pending active centering system, integrated heater and Peltier coolers, and a high precision wafer loading unit. The active centering machine uses capacitance monitoring to ensure the perfect alignment of wafers, so that the bonding process is always accurate. The integrated heater and coolers allow for accurate control of temperature during the process, thus ensuring fine-tuning of the bonding process. The wafer loading tool ensures high accuracy, loading the wafers safely and securely while minimizing contamination from outside sources. EVG 501 also offers the capability to bond die of multiple sizes, with user-selectable sizes, and it utilizes immersion alloys and quick-change bonded pads. These features combine to create a bonder that offers a streamlined, secure and cost-effective bonding process. With EV GROUP 501, users can optimize the parameters for the bonding process, resulting in higher yields and improved product quality. The bonder also features a low-temperature capability, which allows users to bond at temperatures as low as -200 C. This low temperature capability ensures that delicate components and substrates will remain unaffected during the bonding process. 501 utilizes a modular asset, allowing for a more efficient and cost-effective maintenance and upgrade process. This bonder is designed to offer users a secure and cost-effective bonding process with improved yields and product quality.