Used EVG / EV GROUP 510 HE #9271440 for sale

EVG (EV GROUP) EVG / EV GROUP 510 HE is a fully automated bonding equipment used to form electrically and mechanically reliable bonds between semiconductor dies or other materials. This system enables the highest throughput of forming interconnects between multiple dies and passes, even at the smallest size. EVG 510 HE is specifically designed for high-volume production in commercial laboratories and research and development testing facilities. The unit features a combination of advanced thermo-mechanical processes that minimizes cycle time to ensure short time-to-market for its users. The machine is equipped with patented DynoBonder technology which helps to optimize and control the process parameters. It is highly customizable and can accommodate a variety of bonding applications and materials including silicon, indium, copper, and Au/Sn. The tool's control panel is equipped with a user-friendly graphical interface coupled with multiple automatic features for ease of operation. The user-friendly panel can be used to set up and monitor the entire cycle, making it easy to achieve quick learning curves. The asset also provides surface functionalizing tools and inspection accessories, making it ideal for high-volume production runs. The model's BondCell includes a high-speed robot arm, lithography work cell, and bond module. This ensures quality bonds with maximum speed and accuracy. Its high-performance and high-precision robot arm allows for accurate alignments, and is capable of handling compound moisture and aerosols in the sensitive die. The equipment is also equipped with interface software allowing the user to optimize bonding process parameters to achieve maximized throughput. Its advanced control technology makes it easy to monitor and tune process parameters with minimal disruption to the user's production process. Additionally, the system supports multiple modules for different processes like reflow, curing, and other soldering processes. EV GROUP 510 HE offers quick setup, high throughput, and easy maintenance, making it a suitable choice for high-volume applications. Its wide range of features and high precision bonds make it an attractive option for high-volume production, research, and educational labs.