Used EVG / EV GROUP 510 #293631611 for sale

EVG / EV GROUP 510 is a bonding equipment manufactured by EVG, a company based in Austria. It is an advanced system that provides solutions for wafer-level and die-level flip chip bonding, advanced packaging, and dielectric and metallic surface treatments. The unit is designed to provide an economical, convenient, and reliable approach to achieve high-yield and uniform bonds. EVG 510 consists of three main components: a bond head and holder, a bonding pad, and the bonding tool. The bond head and holder are designed to securely attach to the bottom of the wafer or die, allowing it to be moved from one bonding pad to another without damaging the substrate. The bond pad is designed to provide uniform support for both the substrate and the bond. The bonding tool is designed to ensure high-quality bonding with consistent process parameters and accuracy. The tool also has an automated gas machine, allowing for consistent gas distribution and reducing misalignment of the bond. EV GROUP 510 offers a range of options to choose from when selecting the size and shape of the bond. In addition, the bonding tool features a tilt-compensated holder option that ensures that the substrate is accurately and completely supported during the bonding process. An optional encoder mode allows the asset to precisely monitor bond progress and provides feedback on the bond's progress. 510 is ideal for high-volume production and comes with a wide range of accessories, like a power supply, monitor, cryogenic chiller, and heater. The model is also equipped with advanced features, such as an intuitive user interface, automated recipes, and advanced safety features. EVG / EV GROUP 510 is an ideal tool for a variety of advanced packaging applications, such as flip-chip, direct die attach, and modular chip on board. The advanced bonding solutions and process parameters ensure that bonds are uniform and reliable. EVG 510 is a powerful and efficient equipment that can provide optimized results in a short turnaround time.