Used EVG / EV GROUP 510 #293636227 for sale

EVG / EV GROUP 510 is a fully automated wafer bonder designed for rapid prototype and production bonding. Its versatile, repeatable motion control system is suitable for a wide range of precision micro-assembly applications, including 3D packaging, laser diode device assembly, optoelectronic device assembly and other brittle wafer-to-wafer bonding processes. EVG 510 is designed to be easily integrated into a variety of platforms and is available in a variety of sizes and configurations to meet almost any requirement. The device provides precision alignment, repeatable bonding and low-temperature stability with direct-drive tilt stage, linear motor and pneumatic actuation. The bonder also features high-accuracy Z-stage, which maintains a precise 3D plane of alignment throughout the bonding process. The device is compatible with numerous substrate types such as silicon wafers, glasses, metals and plastics. In addition, EV GROUP 510 features an intuitive graphical user interface and is compatible with multiple programs for maximum adjustability. The device also offers a programmable X/Y motor positioning stage and an integral vacuum chuck for holding a substrate during the bonding process. It also includes a variety of tooling options, including different bond heads and a heated chuck stage. The device is designed with a wide range of safety features, such as remotely monitored temperature, pressure and force, as well as auto-stop functions to ensure safe and efficient operation. In addition, the bonder has a low nose clearance, reducing the risk of injury during operation. Finally, 510 is designed to be easy to set up and maintain. Its advanced motion control systems ensure a smooth, cylindrical motion, while its built-in position feedback provides a variety of repeatability options. This ensures consistent and reliable results every time. Furthermore, its user-friendly interface and comprehensive documentation make it simple to operate and maintain. This makes it an ideal option for any precision micro-assembly application.