Used EVG / EV GROUP 510 #293652822 for sale

EVG / EV GROUP 510 is a high-precision standalone wafer bonder specifically designed for the most demanding low-temperature and low-force wafer bonding and thin wafer handling applications. Maximum wafer sizes supported by the bonder are 6 inches (150mm) in diameter. The Group EVG 510 includes advanced features such as a precision motor-controlled z-axis, variable-speed motor-controlled focus and tilt, and a linear stepper motor driven by a two-stage control system which ensures accuracy and repeatability of the bond process. In addition, the Group EV GROUP 510 has the capability of executing different bonding recipes with a Modular Advanced Thin Layer Bonder (MATLB) to ensure uniform temperature and force distribution within the bonding area. The MATLB includes a build-in thin-film heating mechanism to form crucial thin-layer bonds with precise control of both temperature and force, giving the user the highest level of control over the wafer bonding process. The Group 510 also features a programmable thermal pre-bonding process which enables precise control of the substrate temperature to prevent any thermal damages prior to bonding. The thin-film heating element is incorporated into the Machine Control Unit of the Group EVG / EV GROUP 510, which also features a graphical user interface for recipe selection, status monitoring and control of the bonding process. The overall system is designed with safety in mind, and includes a transparent safety door which can be opened and closed at any time during the bonding process. In addition, the Group EVG 510 offers a wide range of custom accessories, including an exhaust system, a built-in cooling fan, vacuum pads and mounting systems as well as custom wafer handling cells to ensure a complete and accurate wafer bonding process. With its high precision, advanced capabilities, and unique wafer handling options, the Group EV GROUP 510 is an ideal choice for any application where highly precise and precise wafer bonds are needed. Its capability to precisely control both temperature and force makes it an ideal tool for those applications which require precise temperature and force control to ensure high-quality production yield.