Used EVG / EV GROUP 520 #293606590 for sale

EVG / EV GROUP 520 is an advanced two-stage bonder designed specifically for high-speed through-silicon via (TSV) creation, as well as die-level and die-attach applications. This bonder features two stages that can be operated independently, with a maximum bond speed of 5 mm/second. The first stage has an integrated heater with a temperature range of 5-170oC and a high power SLED (super luminescent diode) light source. The second stage is an advanced two-axis bonder, with temperature ranges up to 350oC, and an integrated motorized focus system for accurate workpiece placement. EVG 520 also includes an on-board touchscreen with a real-time user-friendly graphical user interface that provides quick and easy operation. EV GROUP 520 can perform a variety of bonding processes, such as thermal compression, thermosonic gold wedge bonding, flip chip bonding, and die-attach. It is capable of placing and bonding individual components as well as multiple devices with a single bond head. The accuracy and precision of the bonder makes it ideal for more tightly spaced components and higher density substrates, such as MEMS and photonics-based devices. The bonder is also equipped with an integrated vision system and automated fiducial mark recognition and tracking features. 520 provides a wide range of programmable parameters, such as motion (position, speed, jerk, and acceleration); temperature; and force/elongation. It also has an automated tolerance compensation feature to ensure a consistent and reproducible bond quality. EVG / EV GROUP 520 is compatible with a variety of substrate materials, including plastics, printed circuit boards, and various types of metal or ceramic packages. EVG 520 is the perfect addition to any production facility that requires reliable, high-quality bonding performance. The combination of its advanced automation, accuracy, and easy operation make it ideal for creating high-performance TSV, die-level, and die-attach packages quickly and easily.