Used EVG / EV GROUP 520 #293761108 for sale

EVG / EV GROUP 520 is a state-of-the-art bonder system used for accurate bonding and packaging processes. This machine has the capability to bond a variety of substrates, ranging from copper, aluminum, ceramics to silicon. It is capable of achieving secure bonds at high speed with high precision due to its patented energy-controlled ( hybrid ) events. The machine is designed to handle large-scale manufacturing applications, including wafer-level-packaging and flip-chip of various market products, thanks to its high throughput and productivity. It is also easily integrated with other downstream processes, for a complete solution. EVG 520 operates with a maximum bonder force up to 170N, with a selectable E-beam power range of 0.5-5 KW (6/13MHz). It provides consistency in bond speeds of up to 12s/chip and operates at a maximum wafer temperature of 220°C. The accuracy of the bonds are maintained with the help of the machine's intelligent temperature controllers. EV GROUP 520 is equipped with a durable and user-friendly user interface, which allows for easy operation and monitoring of the processes. The machine is also designed with built-in safety features including auto-reset / start-up and E-beam shielding options. To ensure long-term operation, the machine is designed with low maintenance requirements. For all your production needs, 520 offers you superior bonding performance with quality and reliability. It is fast, efficient and has a smaller footprint compared to other bonders, making it the ideal choice for fulfilling your bonding requirements.