Used EVG / EV GROUP 520 #293761109 for sale

EVG / EV GROUP 520 is a dual-head, cryogenic, controlled-force bonder for die-level chip-level and chip package assembly. This innovative bonder is designed to enable precise and accurate die-level assembly by combining two temperature-controlled liquid nitrogen delivery systems with an advanced pressure control system. EVG 520 dual-head bonder is the first of its kind, featuring two heads for simultaneous die-bond and package-bond operations for a more efficient production process. Its cryogenic capabilities give users the ability to bond at high temperatures, obtaining temperature uniformity of up to +/-5°C to allow effective interconnects. EV GROUP 520 also offers a unique range of programmable pressure settings for accurate control over die-level bonding process to enable precise and reliable assembly. The pressure controllers can be programmed to achieve expected bonding results through pressure regulation, making it ideal for challenging applications. The bonder is designed with advanced diagnostic functions and control features including a built-in data logger act as a watchdog for process control, and allows users to monitor the progress of assembly operations. The use of liquid nitrogen also reduces the need for frequent cleaning cycles as particles, dust and dirt are suspended in the bonder's freezing environment, making it an ideal solution for workshop conditions. For optimal user experience, 520 is coupled with an intuitive user-friendly Windows-based graphical user interface to allow operators to easily access and control the bonder, effectively communicating the assembly process step-by-step. As such, the bonder is a great choice for intricate die-level and chip package assembly.