Used EVG / EV GROUP 520 #9165244 for sale

EVG / EV GROUP 520 is a high-precision wire and die bonder designed for the most challenging device assembly applications. This fifth-generation tool offers users unparalleled performance with unparalleled accuracy and excellent die placement accuracy. EVG 520 bonder features a 5-axis motorized motion equipment that is capable of placing die, components, and wires accurately and precisely. The five-axis system allows the user to precisely position the die and wire in multiple axes, allowing for higher precision and accuracy. The XYZ coordinates are measured in nanometers, allowing for even further accuracy. Additionally, the tool can also be integrated with vision systems to aid in die placement and component inspection. The bonder includes an integrated die attach unit utilizing a linear slide with a vacuum machine for die mapping and part placement. This feature ensures accurate and repeatable die-to-die bonding. The tool also includes a closed-loop process control tool that uses a combination of thermal and electrical monitoring to ensure the highest levels of process repeatability and accuracy. The asset can measure and monitor wire and die temperatures, current, force, voltage, and contact resistance to ensure optimal performance. Additionally, EV GROUP 520 also features a robust operator interface that allows for easy and efficient operation. The touchscreen user interface conveniently displays operational screens alongside real-time process and bonder performance data helping to ensure the highest levels of productivity. Overall, 520 is a truly advanced and reliable high-performance wire and die bonder and is the perfect tool for those seeking the highest levels of performance and accuracy. The powerful motion model and advanced process control equipment ensure that users can confidently and accurately execute any wire or die attaching operation.