Used EVG / EV GROUP 520 #9229814 for sale
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ID: 9229814
Wafer Size: 6"
Wafer bonder, 6"
Manual wafer load substrate bonder
Capable of anodic, thermal and fusion compression bonding
High vacuum capable bond chamber
Auto opening of bond tool cover
Maximum bond force: 20 kN
Top side heater: 550°C maximum in 1°C step
Bottom side heater: 550°C maximum in 1°C step
Chiller
Temperature uniformity: ±1.5 %
Turbo pump and controller
Roughing pump
Load / Unload tool
Computer monitor and keyboard
Operations manual included.
EVG / EV GROUP 520 is a state-of-the-art microelectronic bonder ideal for a wide range of applications. This model has a 7-axis system with greater flexibility, exceptional speed, and precise alignment accuracy for the most demanding applications. It uses automated placement recognition to minimize time and maximizes accuracy, while also providing precise alignment and bonding of microscopic components. EVG 520 uses an intelligent torque controller to ensure full control with precise torquing for a wide range of applications, including miniature medical devices, semiconductor packages, and microelectronic interconnects. It also has secure bonding and monitoring capability for even the most minuscule of components. EV GROUP 520 is compatible with thermal compression, ball, wedge, and scribe-capable wire bonding techniques, as well as thermosonic ultrasonic or thermal convection-capable devices. Added features of 520 include electric vision, which allows for fast vision set-up and provides real-time camera alignment with automated pattern recognition capabilities. EVG / EV GROUP 520 also has a motorized tool changer, which allows up to sixteen tools to be set up and ready to work in one action, saving time and effort. In addition, EVG 520 can make up to two copper bumps per cycle, obviating the need for a separate copper bump dozer and allowing for higher throughput capabilities. This model is compliant with various safety regulations, including SEMI/IAS-C and ESD standards. The touch screen monitor of EV GROUP 520 offers an intuitive and easy-to-use graphical user interface. It also offers real-time monitoring and process control, complete with audio and video feedback to ensure smooth and accurate handling of the components. 520 also provides support for direct import of DXF, CSV, and BMP files, and can be easily manipulated to accommodate new component designs. To ensure precision and quality, EVG / EV GROUP 520 can be used with customizable recipes, which are adapted to suit each specific application. It also offers maintenance software tools that provide easy access to key parameters and process information, and allow for diagnostics and testing. EVG 520 is designed to be integrated into automation systems for a fully automated system, making it ideal for production processes that require consistent results at high speed.
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