Used EVG / EV GROUP 520 #9281402 for sale

EVG / EV GROUP 520 is a fully automated wire and die bonder capable of performing both wedge and ball bonds for a variety of small-radius 0.7 to 4.0mm diameter applications. EVG 520 is capable of precision bonding at high speed with high accuracy due to its built-in advanced wafer-level metrology equipment and robust platform-based software. The system boasts a highly configurable half-inch fine-pitch auto-alignment capability, with a repeatable accuracy of ± 3.5 µm in X-Y and 12 µm angular accuracy. This advanced unit is capable of bonding both gold and aluminum to copper/gold/molybdenum substrates, in addition to application-specific bonds, such as bonding hard-to-bond materials such as carbide and diamond. EV GROUP 520 is built with an optimized bond head which offers 18 different wedge bond tools, with up to 6 tools installed on the turret simultaneously. This greatly increases process flexibility, as the machine can support processes that require multiple tooling changes. The on-camera software offers flexibility, allowing for automated placement and wire bonding processes. The tool utilizes a magnetic tooling asset and a linear, tiltable bond head for precise multiple bond placement. The integrated microscope allows for visual inspection as well as real-time wire bonding, with top quality images generated both according to IPC standard for production screening as well as for precise component-level inspection. The model offers up to three axis movement control for precise die placement and has a full-featured process control and data logging package for efficient process analysis. The total cycle time for 520 is just 3 seconds. The die bonder also features an integrated safety equipment with overload protection, and uses a dedicated particle filter unit with a HEPA filter to maintain the cleanliness of the workstation. The system is designed for fast and easy setup and installation, and requires minimal servicing and maintenance. Overall, EVG / EV GROUP 520 is a robust and highly reliable die bonder, designed to meet today's most demanding application requirements and provide consistent results. The device's advanced feature set, superior accuracy and short cycle time make it an ideal choice for any application requiring reliable wire and die bonding.