Used EVG / EV GROUP 520IS #9210353 for sale

EVG / EV GROUP 520IS is an advanced wafer bonder, specifically designed for the highest accuracy and precision overflow-edge-seal (OES) wafer bonding operations. It is an ideal solution for wafer-to-wafer, die-to-wafer and die-to-die bonding applications in the semiconductor, optoelectronic, MEMS and photonic industries. It is suitable for all types of standard and low-k, low-dielectric materials and offers excellent control over the temperature, force and speed during the bonding process. EVG 520IS bonder uses advanced Integrated SmartView™ imaging and control. This equipment allows for accurate placement and control of the bond and allows for the detections of unwanted features, such as particles and voids, in the sample. The high accuracy of the system helps to improve the yield and cost of bonding procedures. The bonder includes an integrated, easy-to-use and intuitive GUI with a touchscreen display for controlling and monitoring the bonding process. The unit features a full-area, ActiveX/Unix®-based, local and remote accessibility machine, allowing for easy integration with other equipment and software. It includes servo-controlled XY stages and pressurization features, allowing for precision alignment and accurate temperature control. A user-friendly, automated, high resolution inspection tool including image recognition, magnification up to 1,000x and single die recognition capabilities is also included. In addition, EV GROUP 520 IS bonder is fully capable of interfacing with a clean room environment, including temperature and humidity controls. It comes with a built-in vision asset, as well as multiple safety features, including protective door interlocks, for added safety during operation. EVG / EV GROUP 520 IS is also designed to be highly efficient and cost-effective. It includes an array of integrated tools for process optimization, ensuring maximum throughput and minimum scrap rates. In addition, it has an automated auto-teach feature and supports different types of bonding techniques. The model can be maintained and repaired with minimal effort, and there is an online support equipment available. Overall, EV GROUP 520IS is a versatile, high-precision wafer bonder that is designed to meet the needs of the semiconductor, optoelectronic, MEMS and photonic industries. It is suitable for a wide range of bonding operations, including wafer-to-wafer, die-to-wafer and die-to-die applications. With its advanced Integrated SmartView™ imaging and control system, automated auto-teach feature, built-in safety features and comprehensive maintenance and repair options, EVG 520 IS is an ideal solution for high-precision wafer bonding processes.