Used EVG / EV GROUP 520IS #9229747 for sale

EVG / EV GROUP 520IS is an automated flip-chip bonder designed for research and development applications. It features a servo-controlled bonding head with two degrees of freedom, which enables the bonder to accurately and efficiently bond small near-field communication (NFC) components such as antennas, chips, and similar devices. The system supports high-precision surface-mounted technology (SMT) process operations with placement accuracy of up to ±10µm and high-speed operation with a maximum acceleration of 2G. Its integrated micron-level Z-axis displacement accuracy, combined with 8-mm range of motion, provides a versatile platform for bonding applications. EVG 520IS utilizes a state-of-the-art optical-based detection system to identify components for placement with resolution down to 0.2mm. The bonder is available with a choice of configurations to suit a variety of processes, from standard to advanced. It is capable of handling both single and multicomponent bonding. The system features an integrated design that includes an onboard computer, touch-screen display, and intuitive graphical user interface (GUI) for easy operation. It also offers an API for integration with an external controller and scripting language for custom programming. EV GROUP 520 IS is compatible with a variety of materials, from copper clad laminates and polyimide materials to a range of solder pastes, fluxes, and adhesives. The bonder supports up to three bonding heads to ensure even more precision and flexibility. It is designed for precise, accurate, and repeatable results. The bonder's intuitive GUI offers an extensive library of instructions and features to simplify and reduce the learning curve. It provides an easy and intuitive way to integrate advanced features, such as process monitoring, statistical process control (SPC) modules, and redesigned sequences. 520IS is a cost-effective solution, offering an unbeatable return on investment. It is also compatible with various machines and support systems, making it an ideal all-round solution for flip-chip bonding.