Used EVG / EV GROUP 560 #9137278 for sale

EVG / EV GROUP 560 is a semi-automated bonding platform consisting of an XY-Stage, a heated vacuum chuck, multiple Temperature Controls, and other key components. This semi-automated bonder is specifically designed to deliver high yields and high throughput for flip chip, chip-on-board (COB), and bumping applications. EVG 560 offers a convenient and efficient way to bond and heat-treat components quickly and accurately, allowing for greater efficiency and reduced production costs. The bonder boasts a maximum working area of 600 x 600 mm, and is equipped with the automated feature of a three-axis active substrate holder, providing increased accuracy and efficiency for production processes. The bonder also features an integrated microscope camera, ensuring accurate alignment and precise bonding with minimal potential for misalignment. The integrated field-bus control allows for precise temperature adjustment and better accuracy during heating and cooling processes. The bonder has a range of customizable features, including a wide range of compatible components, a customizable tooling set, and a range of different workflows. The bonder is equipped with six individually temperature-controlled zones, allowing for temperature-accurate and high-yield production. Additionally, the bonder has a range of precision-adjustable ride heights for accurate results. A powerful vacuum-holding system ensures components stay exactasily aligned during the bonding and heat-treatment processes. The intuitive design and features of EV GROUP 560 ensure operators have the ability to adjust production parameters quickly and easily in order to produce repeatable and reliable results. This bonder is robust and reliable, making it an excellent choice for high-volume production lines. 560 is also exceptionally energy efficient making it a cost-effective and sustainable solution for production facilities.