Used EVG / EV GROUP 560 #9181878 for sale

EVG / EV GROUP 560 is a state-of-the-art wafer bonder that is specially designed to provide a precise and secure bonding solution for a variety of applications. EVG 560 is capable of handling most all types of substrates such as silicon, organic and metal and is capable of forming electrical and non-electrical bonds between a two substrates. This bonder is ideal for use in industries such as semiconductor, MEMS, bio-MEMS and medical devices. EV GROUP 560 bonder is designed for accuracy, precision and repeatability; featuring advanced software and hardware features like accurate 3-dimensional alignment, easyrecipe and process optimization. It has an intuitive user interface to allow quick and seamless programming. Its multiMaterial SystemTM can heterogeneously bond several different materials seamlessly despite material variations and microscopic surface topography. It is also equipped with an advanced high resolution camera equipment for detailed process monitoring and automated defect inspection. The bonder is equipped with a single-wafer vacuum chucks as well as an optional load-lock for a variety of substrate sizes up to 200mm. It is engineered for high throughput and productivity with robotic handling capability. In addition, 560 bonder offers many different bonding technologies including thermocompression, thermosonic, edgebond, compression, AC magnetic flux flow and more. It is ideal for packaging, hermetic sealing, bonding membranes, MEMS and opto-mems. Its modular setups allow for a variety of bonding techniques and processes, making it a versatile system. The bonder also offers advanced automation and multiple environment compatibility with its smart cassette unit and SLiC™ software. It can support multiple processes in the same environment parameters ranging from cryogenic temperatures to high temperatures, or from vacuum to ultra-dry nitrogen environments. EVG / EV GROUP 560 bonder is a reliable and efficient tool, enabling the highest production yields with superior product performance. With its advanced software capabilities, high quality mechanical components and streamlined machine design, the bonder is able to offer an efficient, reliable, and precise bonding process to meet any bonding requirement.