Used EVG / EV GROUP 805 #293821878 for sale

EVG / EV GROUP 805 is a state-of-the-art precision die bonder designed to meet the most advanced requirements in the industry. This bonder is equipped with the latest multi-zone process control technology, delivering improved accuracy and repeatability while maintaining versatility. This allows for complete control and optimization of the bonding process without the need for manual intervention. EVG 805 also offers advanced camera and vision systems, including a high-resolution, 5MP camera and an advanced infrared camera. This enables users to accurately position and align dies with minimal effort. Additionally, the camera system can be used for substrate inspection prior to die placement. EV GROUP 805 features an intuitive, user-friendly GUI. This intuitive GUI allows for easy set-up and optimization of each bonder station, including control of bond head, substrate, and XY movements. This allows the operator to quickly and easily set up the equipment and optimize the bond process with minimal training. Furthermore, the integrated process monitoring features can be used to continuously monitor the system and quickly detect any errors or deviations from expected performance. 805 also features a variety of integrated process control functions. This includes wave and ball-copy die positioning, glue pre-dispense compensation, pressure compensation, and temperature limitation. This ensures a consistent result, free from yield issues caused by process variables. The flexible design ensures the bonderies can be at the peak of their performance in small-scale, mid-size, and high volume production. Additionally, the bonder also includes a wide array of process recipes and options, allowing for nearly limitless customization. Overall, EVG / EV GROUP 805 offers a revolutionary solution for high-precision die bonding. This bonder combines rigorous precision with adjustable process control, allowing for optimized performance with minimal manual intervention. As a result, this makes EVG 805 an ideal solution for a variety of die bonding applications.