Used EVG / EV GROUP 805 #9197315 for sale

EVG / EV GROUP 805 bonder is a precision manual desktop wedge-wedge bonder designed for efficient and cost-effective wire bonding production. EVG 805 bonder is the ideal solution for semiconductor manufacturers looking for a low cost, high-performance solution for wire bonding of small to medium-size semiconductor devices. EV GROUP 805 bonder is suitable for crucial production processes such as bonding in-line chip scale packages (ICSPs) as well as MEMS devices where accuracy and repeatability are key. 805 bonder offers an intuitive user interface that allows easy setup of equipment parameters and operation with minimal operator training and no need for a separate computer to program or monitor. The bonder is capable of reaching temperatures up to 850°C and run times of up to 40 seconds, allowing for a wide range of bonding processes. EVG / EV GROUP 805 bonder is designed to be ergonomic for the operator, fitting into the working environment with a footprint of only 460 x 640mm and a height of 515mm. A 135mm travel range on the X-axis allows for bonding on a wide range of device sizes. EVG 805 bonder is also designed to be flexible, featuring an adjustable head mount and optional attachable heads to accommodate a variety of bonding wires and devices. The bonder supports a pressure range between 0.3 - 3.0N, allowing for a wide range of bond force, while its shuttle mechanism ensures a precise and repeatable bond. The bonder also includes a tiltable 6" wide x 5" deep bond chamber, which allows for finer placement of the bond wire and device. Additionally, EV GROUP 805 bonder supports a variety of bonding techniques, such as ball, ribbon, stitch, wedge, and press bonding. To improve speed and accuracy, 805 bonder also includes an automated device sensor calibration and an optional optical viewing system. An automated device calibration feature allows the bonder to recognize the exact size and shape of the device, while the optional optical viewing system helps reduce the probability of incorrect bonding due to optical zoom in and out, focus, and field of view adjustment. Overall, EVG / EV GROUP 805 bonder is an excellent solution for small to medium sized semiconductor devices, offering high precision and repeatability at a cost effective price. EVG 805 bonder's user-friendly design, adjustable head mount and shuttle mechanism, and automated calibration features make it an ideal solution for quick, accurate, and efficient wire bonding production.