Used EVG / EV GROUP 805 #9245375 for sale

EVG / EV GROUP 805 is a fully automated, semi-automated and manual bonding equipment specifically designed for the assembly and packaging requirements of the microelectronics industry. It is a powerful and versatile platform offering a wide variety of applications including flip-chip, copper, gold, die attach, and wire bonding technologies. EVG 805 system is equipped with guaranteed performance on any substrate, film, lead frames or disk. This includes gold-on-gold, die on bump, die on die, bump on substrate, eutectic and soft die attach, copper bonding, and wire bonding capabilities. This complete unit supports all types of die and lead frames up to 28" (710 mm) in size. EV GROUP 805 platform is equipped with a modular design, allowing users to configure their machine to meet specific application needs. This includes integrated programmable heaters on the bond head and vacuum work surface for precise heat energy delivery. The vacuum work surface provides better control over substrate transport and can be set up for any size substrate from small wafers to larger ceramics or substrates. 805 machine also features a vision tool for die alignment and ball placement as well as advanced software to support a wide range of process parameters and user-defined recipes for efficient process management. The platform can be adapted to meet specific customer needs with hot force control, ball size detection, molten capillary detection, self-adjusting bond force, overtravel detection, material classifying, and more. The asset provides superior bondhead motion control and offers flexible bonding strategies, allowing users to tune pre-programmed parameters to their own unique processes. This level of control is essential for intricate and sensitive assembly applications requiring precise control of bondhead motion. EVG / EV GROUP 805 model is designed for use in a normal cleanroom environment and requires no special infrastructure. It is compatible with the ink jetting and lithography printing capabilities of other EVG equipment to complete end-to-end solutions for microelectronic chip assembly, push-to-connect methods, and electrical interconnects. EVG 805 also offers a wide range of options for customizing its features and capabilities. These options include compatible bondheads, automated die and lead frame handling, automated tip changing, thermosonic wire bonding, integrated cleaning and de-flashing capabilities, and more. Overall, EV GROUP 805 is designed to meet the needs of today's demanding semiconductor production environment with a modular, configurable, and user-friendly platform that offers a wide range of applications. Its performance and superior bonding capabilities offer accurate and reliable assembly solutions for a variety of complex applications across the microelectronics industry.